CASEST

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Centre for Advanced Studies in Electronics Science and Technology
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Centre for Advanced Studies in Electronics Science and Technology
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Centre for Advanced Studies in Electronics Science and Technology
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CASEST

The Centre for Advanced Studies in Electronics Science and Technology (CASEST) is a successor to the DoE/UGC Electronics Programme initiated in 1995-96 to carry out research and teaching in Electronics Science. The Centre is supported by the UGC’s Special Assistance under DRS-1. The Centre offers three programmes: Master of Technology in Integrated Circuits Technology [M.Tech. (ICT)], Master of Technology in Microelectronics & VLSI Design [M.Tech. (MVLSI)], and Ph.D. in Electronics Science and Engineering

MILESTONES

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The centre will be a multi-disciplinary hub of excellence that aims to attract talent from a wide range of fields to enable establishment of a truly world-class centre for research in Electronics Science and Technology.

Research

The main objective will be to create and develop a world class multi-disciplinary research environment, supported by strong research funding and industry collaborations in the following broad research groups and areas:

Integrated Circuits and Systems Design

Digital, Analog, RF and Mixed-Signal IC Design, MEMS, MMICs, RFICs and NEMS, VLSI design, FPGA design, DSP algorithms, Systems design and Soft Computing, Simulation, modeling and algorithm development, Embedded systems, Smart grid, Nano-electronics, RF electronics, SIP and SOC.

Materials, Sensors and Device Technology

Micro- and Nano-fabrication of device structures, Materials and Phenomenon for electronic applications, Process Science and Technology for Micro-fabrication, Ion-beam techniques for micro- and nano-electronics, Thin-films and Technology for electronics, Alternate dielectric films and other materials for new generation of MOS and other devices, flexible electronics.

Vector Network Analyzer measurements systems (1)

Test, Measurement, Verification, Packaging for Product Development

On-wafer probing techniques over wide frequency, temperature and field ranges, 3D packaging, EDA tools and related software, design for testability.